PCB manufacturing commonly faces various defects due to factors such as machine errors or human mistakes, including issues like “hole breakout” and “point PCB breakout.” These defects arise from inadequate slag removal processes during PCB processing, affecting product quality.
Modern electronic devices require PCB factories to adopt multi-layer HDI PCB buried blind via processing solutions to accommodate the large number of components on the surface, necessitating fine conductor widths and narrower spacing between them. WellCircuits Limited specializes in producing high-precision double-sided, multi-layer, impedance-controlled, blind buried vias, and thick copper circuit boards to meet customer demands for various products.
The main reasons for copper rejection in PCB factories are over-etched copper foil, local collisions during manufacturing, and unreasonable PCB circuit design, leading to insufficient bonding strength and eventual copper wire detachment.
Three Primary Causes of Copper Rejection in PCB Manufacturing Facilities Read More »
The main reasons for copper rejection in PCB factories are over-etched copper foil, local collisions during manufacturing, and unreasonable PCB circuit design, leading to insufficient bonding strength and eventual copper wire detachment.
Three Primary Causes of Copper Rejection in PCB Manufacturing Facilities Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.