The development of modern electronic science and technology increasingly demands higher precision in PCBs, with lamination playing a pivotal role in embedding copper layers within substrates to prevent unintended signal conduction or current flow. Various laminating processes cater to different PCB types, including multilayer and double-sided boards, as well as specialized laminates like PTFE for RF applications. PCB prototyping requires careful consideration of sample quantity, component assembly verification, and comprehensive electrical testing to ensure high-quality prototypes and smooth transition to mass production.