What is a Test CouponA test coupon is a small section of the PCB that is designed with specific dimensions and electrical properties such as trace widths trace spacing and impedance values to det
PCB copper trace detachment is typically caused by factors such as excessive copper etching, mechanical damage, poor circuit design, laminate manufacturing issues, or raw material defects, which affect the bond strength between the copper foil and substrate.
Analyze the underlying causes of PCB disposal practices Read More »
The PCB pre-processing stage is critical for manufacturing quality, involving complex equipment and processes that can be impacted by various factors such as human, machine, material, and environmental issues, which can lead to defects like surface roughness, oxidation, and circuit deformation, and requires careful monitoring and maintenance to ensure optimal results.
Why can PCB pre-processing lead to production issues? Read More »
Copper wire detachment in automotive PCBs, often attributed to laminate issues, arises from factors like over-etching, residual etching solution, mechanical collisions, poor circuit design, laminate manufacturing flaws, and mismatched material compatibility.
Factors Contributing to Copper Deposition on Automotive Circuit Boards Read More »
The PCB manufacturing process is prone to defects from machine errors and human factors, particularly during slag removal, which can lead to issues like point-shaped ruptures and incomplete copper deposition if not carefully monitored throughout each processing stage.
Analysis of Anomalies in PCB Circuit Board Fabrication Read More »
PCB designs may look similar at first, but significant internal differences impact their reliability and performance, making high-quality design a crucial investment to avoid costly failures in critical applications.
Are you familiar with some key characteristics of PCB design? Read More »
During double-sided SMD soldering on PCBA, skipping initial side soldering to save costs can cause components to fall off due to insufficient vertical solder adhesion, primarily from heavy components, poor solderability of PCB pads, or inadequate solder paste wettability.
Understanding Common Issues with SMT Solder Paste Read More »
Copper particle formation on PCBs during manufacturing arises from various stages in the copper immersion process of multilayer circuit boards, influenced by factors like water hardness, borehole dust, and inadequate maintenance of processing tanks and solutions.
PCB Manufacturing: Detailed Secondary Copper Immersion Process Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.