PCB manufacturing solutions

Challenges Faced in the PCB Solder Mask Application Process

The article summarizes common quality issues and solutions in the PCB solder mask process, emphasizing the importance of proper techniques and adjustments to mitigate frequent problems encountered in the industry.

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Are you aware of the defects associated with electroplated pure tin on PCBs?

Many PCB manufacturers continue using wet film imaging due to cost, which can cause issues like “seepage” during pure tin electroplating; this article offers solutions and outlines the electroplating process while emphasizing the importance of proper wet film handling and process control.

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How to prevent common failures in PCB design practices

In the age of technological innovation, electronic devices and instruments pervade all manufacturing entities, and even brief downtime or electronic failures can cause significant economic losses; thus, protecting printed circuit boards (PCBs) from environmental damage, especially moisture and thermal extremes, is crucial to avoid financial impacts and operational inefficiencies.

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