#pcb manufacturing

PCB Plated Hole Filling Technology

The global electroplating PCB industry is rapidly growing, driven by the need for advanced hole filling solutions like electroplating to enhance electrical performance, heat dissipation, and via stacking, with key factors such as anode type, cathode-anode distance, current density, and substrate material influencing the process.

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AOI Inspection Steps for PCB Technology in DIP Through-hole Plug-in

The DIP package involves integrating small to medium-sized ICs in a dual in-line configuration, with careful handling and specific insertion and soldering processes to ensure proper functionality and avoid damage, followed by post-soldering inspections and testing.

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Process Specifications for PCB Fabrication

PCB processing requires a comprehensive understanding of various methods and materials, with strict adherence to procedures for handling, identification, and finishing to ensure high-quality, durable products while meeting environmental and industry standards.

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Techniques for PCB Cleaning and the PCB Manufacturing Process

PCB manufacturing in China generates various pollutants, necessitating effective cleaning to prevent circuit board failures, and utilizes semi-aqueous cleaning methods with safe, flammable solvents and water for optimal results.

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PCBA selects counterfeit electronic components, posing significant risks.

PCBA processing involves selecting electronic components while considering factors like size, cost, reliability, and the risks posed by counterfeit parts, all of which are crucial in various high-stakes industries.

PCBA selects counterfeit electronic components, posing significant risks. Read More »

What are the key factors influencing the quality of PCBs?

The PCB industry is rapidly growing amidst intense competition, with many manufacturers focusing on cost reduction at the expense of quality, leading to production issues caused by inadequate technology, outdated equipment, poor raw materials, and disorganized management practices.

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Potential Causes of PCB Micro Short Circuits

The article discusses the CAF (Conductive Anodic Filament) phenomenon in PCBs, detailing its causes, persistent issues faced by Shenzhen Honglijie, and strategies for prevention, emphasizing the importance of specific conditions and material choices to mitigate micro-short circuits.

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What is the role of gold in PCB circuit boards?

The article explains the distinctions between hard gold, soft gold, and flash gold in PCB manufacturing, emphasizing their compositions, applications, and electroplating processes, while clarifying common misconceptions in the industry.

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In the PCB manufacturing facility, the ‘repair line and PCB thickness’ are critical factors to consider.

In PCB manufacturing, wire patching is generally limited, especially on outer layers, with specific guidelines for repairs, such as one repair per board and adherence to IPC standards; edging is crucial to prevent contamination during various production stages, with trimming methods preferred for boards under 16 mil in thickness.

In the PCB manufacturing facility, the ‘repair line and PCB thickness’ are critical factors to consider. Read More »

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