The PCB comprises various components and processing technologies, featuring single-layer, double-layer, or multi-layer structures, each with distinct production methods and functional layers, including signal, protective, silk screen, and internal layers.
Which components are present on the printed circuit board (PCB)? Read More »
Today, mass-produced electronic hardware predominantly uses surface mount technology (SMT), which expedites PCB production and offers numerous advantages, despite challenges like component mounting offset and limitations for high-stress components.
Common Defects in SMT Impacting PCB Production Efficiency Read More »
The text explores various methods and challenges in PCB etching, emphasizing the complex chemical and physical reactions involved, particularly focusing on etching quality, equipment adjustments, and maintenance practices.
PCB fabrication: etching process and process control Read More »
The PCB is made up of various components and complex technologies, with single-layer, double-layer, and multi-layer structures each requiring different production methods. It includes pads, vias, mounting holes, wires, connectors, filling, and electrical boundaries, each with specific functions. The three common layer structures are single-layer, double-layer, and multi-layer boards, with multiple working layers and connections through vias in the latter.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.