PCB production methods

Which components are present on the printed circuit board (PCB)?

The PCB comprises various components and processing technologies, featuring single-layer, double-layer, or multi-layer structures, each with distinct production methods and functional layers, including signal, protective, silk screen, and internal layers.

Which components are present on the printed circuit board (PCB)? Read More »

Common Defects in SMT Impacting PCB Production Efficiency

Today, mass-produced electronic hardware predominantly uses surface mount technology (SMT), which expedites PCB production and offers numerous advantages, despite challenges like component mounting offset and limitations for high-stress components.

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PCB fabrication: etching process and process control

The text explores various methods and challenges in PCB etching, emphasizing the complex chemical and physical reactions involved, particularly focusing on etching quality, equipment adjustments, and maintenance practices.

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What Are The Key Functions of PCB Board 1

The PCB is made up of various components and complex technologies, with single-layer, double-layer, and multi-layer structures each requiring different production methods. It includes pads, vias, mounting holes, wires, connectors, filling, and electrical boundaries, each with specific functions. The three common layer structures are single-layer, double-layer, and multi-layer boards, with multiple working layers and connections through vias in the latter.

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