The multi-layer PCB process often faces complex challenges related to people, machines, materials, and conditions, and this discussion aims to address these issues by focusing on pre-treatment equipment, brushing and grinding procedures, and factors impacting board quality.
Root Cause Analysis of Defects in Multilayer PCB Manufacturing Processes Read More »
Silk screen pretreatment significantly impacts PCB board appearance, influencing factors such as ink adhesion and oxidation prevention on copper surfaces, crucial for meeting high-quality standards and minimizing rework, thereby enhancing overall company competitiveness.
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