Surface treatments for PCB circuit boards, such as tin spraying (HASL), OSP, and immersion gold (ENIG), protect the copper from oxidation, enhance solderability, and meet the evolving needs of modern electronics, but each has its own advantages, limitations, and environmental considerations.
After developing the copper thickness of the exposed circuits needs to be increased by a secondary copper plating namely pattern plating The purpose is to make the hole copper and surface copper of
Modern PCB surface treatment technology combines traditional plating methods with advancements in materials science and engineering to enhance properties like conductivity, heat resistance, and wear resistance, while ensuring compatibility with substrate materials and the feasibility, controllability, and detectability of the coating process for high-quality, efficient manufacturing.
Technology in the electroplating of PCB circuit boards Read More »
The choice of PCB surface treatment (HASL, ENIG, or OSP) depends on factors such as cost, component size, solderability, and environmental concerns, with each method offering distinct advantages and disadvantages for different applications.
How to select between HASL, ENIG, OSP, and other PCB surface finishes Read More »
The choice of PCB surface treatment (HASL, ENIG, or OSP) depends on factors such as cost, component size, solderability, and environmental concerns, with each method offering distinct advantages and disadvantages for different applications.
How to select between HASL, ENIG, OSP, and other PCB surface finishes Read More »
The immersion gold process is a costly surface treatment for circuit boards, essential for specific applications like gold fingers and fine line widths, but less suitable for others, and it offers advantages in heat dissipation, soldering strength, and measurement reliability compared to alternative methods like OSP and silver treatments.
The Unique Role of the PCB Immersion Gold Process Read More »
To meet stringent technical standards, PCB manufacturers invest in enhancing metal surfaces using non-woven materials for their effectiveness in polishing and deburring, while also considering factors like abrasive types, wheel speed, and pressurization during the manufacturing process.
Surface Preparation of PCB Printed Circuit Board Metals Read More »
The article explains the surface treatment processes for PCB circuit boards, focusing on the differences between immersion gold and gold plating, highlighting their distinct properties, applications, and advantages in electronic manufacturing.
Distinction between PCB Gold Sinking and Gold Plating Processes Read More »
Experts evaluate the characteristics, advantages, and disadvantages of various PCB surface treatment technologies, highlighting their solderability, oxidation susceptibility, and performance trade-offs.
Experts provide an overview of PCB surface treatment technologies. Read More »
The choice of PCB surface treatment processes depends on the final assembly components, with five common methods including hot air leveling, organic coating, electroless nickel/immersion gold, immersion silver, and immersion tin, each offering specific advantages and limitations for different applications.
Typical Applications of PCB Surface Treatment Processes Read More »
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