The main causes of PCB soldering defects are poor solderability of PCB holes, warpage during soldering, and improper PCB design, all of which can lead to issues like unstable connections, cold joints, or poor solder quality.
Warpage in BGA packages and PCBs, caused by thermal expansion mismatches and heating-cooling cycles, can lead to circuit failures, but can be mitigated through careful temperature control, moisture management, and optimized solder paste application.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.