PCB deformation during processing is caused by thermal and mechanical stresses, which can be mitigated through careful design, proper handling, and specific post-processing steps like stress relief, drying, and controlled cooling.
Reasons for PCB Deformation and Preventive Measures Read More »
PCB bending and warping during manufacturing primarily stem from uneven thermal stress, material properties, and structural design, which can be mitigated through temperature control, using high Tg materials, increasing board thickness, reducing size, employing stabilization fixtures, and minimizing V-Cuts.
Factors Contributing to PCB Warping and Mitigation Strategies Read More »
Bare PCBs should not be removed from the oven immediately after drying at 150°C; they must cool slowly to below 60°C to prevent warping caused by rapid cooling disparities.
Moisture Evacuation and Stress Mitigation Prior to PCB Soldering Read More »
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