The double-sided PCB manufacturing process includes methods like SMOBC (Solder Mask Over Bare Copper) and pattern plating, with key steps such as electroless copper plating, lead-tin stripping, hole plugging, and hot air leveling, aimed at improving solderability, reliability, and circuit integrity.
How are double-sided printed circuit boards (PCBs) manufactured? Read More »
IntroductionKnowing the energy amount that is left in a battery at use as compared to when the battery was fully charged informs the user how further the battery will keep performing before initiating
Key Techniques for Assessing Battery State of Charge – PCB Fundamentals – Wellcircuits Read More »
In PCB design, the process involves defining system specifications, creating a functional block diagram, partitioning the system into multiple PCBs, selecting packaging methods, determining PCB sizes, and arranging components for efficient routing before finalizing the design and ensuring it meets all relevant standards.
How to design the process for a PCB circuit board Read More »
Effective anti-ESD measures in PCB design involve careful layering, layout optimization, and installation techniques to mitigate risks and protect sensitive components from damage.
Preventing static discharge in PCB circuit boards. Read More »
The summary outlines key steps in PCB board drawing technology, emphasizing the importance of using network labels for pin identification, proper component packaging, generating netlists, setting design rules, and ensuring a well-planned layout with correct trace widths and routing practices to avoid errors during PCB design.
Copper wire detachment in automotive PCBs, often attributed to laminate issues, arises from factors like over-etching, residual etching solution, mechanical collisions, poor circuit design, laminate manufacturing flaws, and mismatched material compatibility.
Factors Contributing to Copper Deposition on Automotive Circuit Boards Read More »
The article discusses advancements in PCB technology, highlighting the integration of chip-level design with board assembly and the complexities introduced by high-density packaging, particularly regarding the use of underfill to manage thermal expansion and reliability challenges.
Key Considerations for Filling Design and PCB Fabrication Processes Read More »
The article discusses the challenges and solutions for using a three-layer FPC in the HotBar process, highlighting the risks of overheating and reliability issues, while proposing alternative methods, including low-temperature solder paste and manual adjustments for effective soldering.
Production of low-temperature solder paste for HotBar soldering applications. Read More »
The operational process of PCB circuit boards involves planning their structure, configuring parameters, careful component layout, establishing wiring rules, and ensuring quality materials, ultimately enhancing performance and lifespan while facilitating maintenance and safety.
Introduction to PCB Working Links and Their Characteristics Read More »
The article discusses the evolution of flexible circuit boards (FPC), focusing on their production process, materials, and challenges in cutting accuracy due to expansion and contraction, proposing a CCD-based method to improve precision in laser cutting for FPC connections.
How can we address the issue of cutting deviations in FPC boards? Read More »
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