peeling strength

Factors Leading to Detachment of Copper Traces on Impedance-Controlled

Copper wire detachment on impedance circuit boards can be attributed to issues such as over-etched copper foil, residual etching solution, unreasonable circuit design, abnormal electrolytic copper foil, and poor etching of potion. Selecting a manufacturer with robust process capabilities and quality materials can help mitigate this problem.

Factors Leading to Detachment of Copper Traces on Impedance-Controlled Read More »

What are the precautions for the orientation and geometric design of printed circuit board (PCB) traces?

The precautions for the direction and shape of PCB printed wire include using short and simple wires, avoiding sharp bends or acute angles, maintaining equal distance between wires and pads, adjusting wire width based on pad spacing, reserving copper foil for common grounding wires, and providing a non-conductive production line on the PCB board to increase peeling strength of the pad.

What are the precautions for the orientation and geometric design of printed circuit board (PCB) traces? Read More »

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