pits

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3

3. Various processes can lead to pit formation during electroplating, including copper immersion, pattern transfer, and inadequate cleaning during pre-treatment and plating. 4. Issues with air agitation, cotton cores, and cleaning after degreasing can result in whitish or uneven color on the board surface during electroplating. Concluding Remarks: Troubleshooting and innovation are essential for improving craftsmanship and achieving high-quality coatings in the acid copper plating process.

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3 Read More »

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3

3. Various processes can lead to pit formation during electroplating, including copper immersion, pattern transfer, and inadequate cleaning during pre-treatment and plating. 4. Issues with air agitation, cotton cores, and cleaning after degreasing can result in whitish or uneven color on the board surface during electroplating. Concluding Remarks: Troubleshooting and innovation are essential for improving craftsmanship and achieving high-quality coatings in the acid copper plating process.

Common Issues and Resolutions in PCB Copper Sulfate Electroplating Process Volume 3 Read More »

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