Electroplated through-holes in PCBs facilitate electrical conductivity through layers via copper-coated conduits, crucial for multi-layer designs, with manufacturing involving drilling, electroplating, and copper deposition, while challenges like void formation due to uneven coating necessitate adherence to manufacturer guidelines for optimal performance.
This chapter provides an overview of the electroless copper process used in the production of printed circuit boards, emphasizing the critical points of chemical copper deposition and the various substrates and methods used in the process.
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