polyester

Processing techniques for PCB pads and utilization of FPC materials

FPC, or flexible printed circuit, utilizes a flexible substrate like polyimide or polyester, allowing it to bend or fold for diverse applications, often protected by a cover layer. Connections to PCBs employ methods such as ENIG, tin-lead, SEG, OSP, and HASL, balancing technical advantages with environmental considerations.

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How to apply Flex PCB Stiffener professionally?

Flexible circuits, made of polyimide or polyester film, are widely used in electronic products, and adding stiffeners like steel, FR4, PI, and aluminum can enhance their overall strength. The mounting methods for FPC flexible circuit board stiffeners include manual, stamping, and suction methods, with the suction method offering high placement accuracy and fast speed for mass production.

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Introduction to Selection Criteria for 5 Flexible PCB Materials

Flexible circuits, enabled by Surface Mount Technology (SMT), revolutionize electronic assembly, offering ultra-thin, highly adaptable circuits for diverse applications, leveraging materials like polyimide film, adhesive sheets, copper foil, and protective coatings to enhance functionality and durability.

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