The poor plating during PCB electroplating is caused by various factors such as pinholes, pitting, airflow streaks, exposure, brittle coating, air pocket, tin flower, climbing tin, whisker tin, and orange peel-like coating.
Description and Causes of Inadequate Plating in Electroplating Read More »
Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.
Reasons of Poor Plating During PCB Electroplating Read More »
Description and reasons for poor plating during PCB electroplating include recess plating, loose dendritic coating, double-layer plating, blackened coating, passive peeling, replacement peeling, peeling due to oil pollution, dark round spot coating, uneven gloss and thickness, and chemical fiber contamination.
Description and Causes of Deficient Plating in the Electroplating Process Read More »
The poor plating during PCB electroplating is caused by various factors such as pinholes, pitting, airflow streaks, exposure, brittle coating, air pocket, tin flower, climbing tin, whisker tin, and orange peel-like coating.
Description and Causes of Inadequate Plating in Electroplating Read More »
Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.
Reasons of Poor Plating During PCB Electroplating Read More »
Description and reasons for poor plating during PCB electroplating include recess plating, loose dendritic coating, double-layer plating, blackened coating, passive peeling, replacement peeling, peeling due to oil pollution, dark round spot coating, uneven gloss and thickness, and chemical fiber contamination.
Description and Causes of Deficient Plating in the Electroplating Process Read More »
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