Prepreg materials

Manufacturing Process of Copper Clad Laminate for PCBs

PCB board copper clad laminate is a substrate material used for making printed circuit boards, supporting components while enabling electrical connections or insulation. The manufacturing process involves impregnating materials like glass fiber cloth or paper with adhesives such as epoxy or phenolic resin, followed by lamination with copper foil and application of heat and pressure to create the final laminate.

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Terms for PCB board appearance and functional testing

Production Board is a PCB board that meets design drawings, specifications, and procurement requirements in one batch. As Received products undergo mechanical testing without conditioning. Test Board determines batch quality, Test Pattern is used for testing, and Quality Conformance Test Circuit assesses printed board quality. Visual examination of appearance and size includes detecting issues like Blister, Bulge, or Cracking. Electrical and non-electrical properties, such as Contact Resistance or Bond Strength, are also assessed. Prepreg materials and adhesive films are evaluated for parameters like Resin Flow or Tack Time.

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