Printed Circuit Board

The Significance of Electroplating in PCB Manufacturing

Copper is commonly used on printed circuit boards for interconnecting components, but requires protection from oxidation and corrosion through technologies like organic paint, oxide film, and electroplating, with gold being a common plating material for high wear resistance and low contact resistance.

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Factors Influencing the Visual Quality of PCBs in the Pre-Processing Stage for Silkscreen Applications

The appearance quality of printed circuit boards is crucial, with silk screen pretreatment playing a key role in ensuring uniform ink color and preventing oxidation on the copper layer to avoid rework and loss of orders.

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Solder Mask Implementation in PCB Manufacturing: Step 1 – Exposure

The solder mask process in printed circuit boards involves applying a protective layer to cover pads and aligning it before exposure to ultraviolet light for lead and tin application during hot air leveling.

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Principles of Printed Circuit Board Design: Part 2

The basic principles of PCB design include maintaining a small distance between lead ends, concentrating inlet and outlet ends on one or two sides, arranging pins in a sequential order, and designing in a systematic way.

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Automatic Detection Technology for Printed Circuit Board Pin Bed Testing Method

The needle bed test method is an automatic detection technology for printed circuit boards that uses probes with springs to exert pressure on detection points, allowing for programmed detection of signals and points with the use of detection software.

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Review and Analysis of PCBs, Raw Materials, and Industry-Affiliated Companies

Printed circuit boards are a crucial substrate for electronic parts assembly, with a global output value of $45 billion per year, predominantly driven by China’s rapid growth and market advantages. The industry is shifting towards China, especially in the high-end segment, leading to increased production capacity and development towards high-end products. This trend is also affecting the copper clad laminate (CCL) and downstream machine products market, with concentration and pricing pressures in the short term but opportunities for small-scale manufacturers in specific market segments. The industry is facing challenges from raw material price increases, environmental regulations, and the need for technological innovation to meet emerging industry and customer demands.

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The manufacturing process for ultra-thin PCBs.

The trend towards ultra thin PCBs with high-density interconnections and small apertures is driving the development of new equipment and processes to overcome prior art shortcomings and provide a manufacturing method for fabricating ultra thin PCBs.

The manufacturing process for ultra-thin PCBs. Read More »

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