production challenges

Challenges in Prototyping Multilayer PCBs Production

Multi-layer PCB production faces challenges in inner circuit complexity, alignment between layers, pressing processes, and drilling production due to increasing requirements in various industries. Recommendations include designing wider line widths, ensuring even distribution of copper, and maintaining proper hole edge spacing.

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Switching Time and Specificity in PCB Assembly

Electronic product assembly faces challenges due to the large number and variety of components and short product life cycle, leading to complex production scheduling. The assembly line consists of high-speed and multi-functional placement machines, with switching times being a critical factor in the process. Production scheduling is divided into board-level and group-level to optimize efficiency and minimize switching times.

Switching Time and Specificity in PCB Assembly Read More »

Challenges in Prototyping Multilayer PCBs Production

Multi-layer PCB production faces challenges in inner circuit complexity, alignment between layers, pressing processes, and drilling production due to increasing requirements in various industries. Recommendations include designing wider line widths, ensuring even distribution of copper, and maintaining proper hole edge spacing.

Challenges in Prototyping Multilayer PCBs Production Read More »

Switching Time and Specificity in PCB Assembly

Electronic product assembly faces challenges due to the large number and variety of components and short product life cycle, leading to complex production scheduling. The assembly line consists of high-speed and multi-functional placement machines, with switching times being a critical factor in the process. Production scheduling is divided into board-level and group-level to optimize efficiency and minimize switching times.

Switching Time and Specificity in PCB Assembly Read More »

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