The technical advantages and challenges of Surface-Mount Technology (SMT) and Through-Hole Technology (THT), discusses the integration of these technologies with the THR (Through-Hole Reflow) process to reduce production costs, and highlights design considerations for connectors suitable for THR assembly.
THR (Through-Hole Reflow) Soldering Technology for PCB Components Read More »
The main issue with spliced PCB boards is the need to reduce production costs, with careful consideration required for materials, orientation, connector extension, positioning points, and design to prevent processing issues.
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