refrigeration.

FPC Coverlayer Film

Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.

FPC Coverlayer Film Read More »

FPC Coverlayer Film

Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.

FPC Coverlayer Film Read More »

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