Is there residual copper in the FPC affecting impedance calculations?
The impedance of flexible printed circuits (FPC) can be calculated by considering factors such as the dielectric constant, copper thickness, trace width and spacing, and dielectric layer thickness, while residual copper after etching can arise from incomplete developing or issues with the etching process, necessitating adjustments to improve etching efficiency.
Is there residual copper in the FPC affecting impedance calculations? Read More »