return loss

PCB interconnect design minimizes RF interference.

As data rates rise, PCB design faces challenges in handling high-frequency signals, particularly around 1 GHz, where electromagnetic interference, return loss, and impedance mismatches impact signal integrity; solutions include optimizing trace spacing, managing ground planes, and addressing interconnection points, while innovations like local wireless chip-to-board communication aim to keep pace with advances in IC design.

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Six methods for debugging module PCB boards

The design and manufacturing of PCB boards play a crucial role in determining the performance indicators of the six types of modules, with important parameters including insertion loss, return loss, and near-end crosstalk. Failure mechanisms such as signal leakage from modules and plugs can be addressed through approaches like balanced transmission and high-speed communication connector manufacturing. Domestic counterparts need to focus on designing compensation circuits and optimizing process parameters for successful trial production of super six-type modules.

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