roughness and burrs

Root Cause and Solutions for Issues in PCB Nickel Plating Process

This article covers potential issues and troubleshooting methods for PCB nickel plating, including porkmark, roughness, low adhesion, brittle coating, dark plating, coating burns, low deposition rate, and blistering or peeling of the coating.

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Causes and Remediation of Defects in Electroplating Nickel Processes

The causes and elimination of faults in PCB electroplating nickel process include organic pollution leading to makeng and pinholes, roughness and burrs due to impurities, low adhesion from poor deoxidation, coating brittleness and poor weldability from organic and heavy metal pollution, uneven color and dark coating from metal pollution, coating burn from various factors, low deposition rate from low pH or current density, blistering or peeling from various factors, and anode passivation from insufficient anode activator and other factors.

Causes and Remediation of Defects in Electroplating Nickel Processes Read More »

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