To master high-speed PCB design, it’s crucial to understand transmission lines, which are signal paths with specific impedance that can cause reflections and delays if mismatched, potentially leading to system errors.
This article emphasizes that for optimal signal integrity in PCB design, it’s crucial to maintain uniform characteristic impedance and minimize impedance discontinuities to prevent signal reflection and distortion, especially for high-frequency signals.
Impedance discontinuities in PCBs lead to signal reflections. Read More »
When PCB trace widths change, impedance variations can cause signal reflections, which may be significant depending on the impedance change magnitude, signal rise time, and trace length; careful analysis and impedance matching can mitigate these effects.
Reflection resulting from variations in PCB trace width Read More »
In PCB layout, the change of line width can cause impedance change and reflection, which can affect the signal. Whether this effect needs to be considered depends on the size of the impedance change, the signal rise time, and the delay of the signal. The reflection can be reduced through impedance matching terminations and careful analysis of the parameters involved.
Layout is essential in PCB design, with wiring quality directly affecting system performance, especially in high-speed design where right-angle wiring should be avoided due to impedance discontinuity, and where differential routing offers advantages in immunity to interference and accurate timing positioning.
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