The double-sided PCB manufacturing process includes methods like SMOBC (Solder Mask Over Bare Copper) and pattern plating, with key steps such as electroless copper plating, lead-tin stripping, hole plugging, and hot air leveling, aimed at improving solderability, reliability, and circuit integrity.
How are double-sided printed circuit boards (PCBs) manufactured? Read More »
The SMOBC process and plugging method are used for pattern electroplating and lead and tin stripping, with steps including copper clad board preparation, lead and tin removal, solder mask patterning, plating, and hole plugging. The plugging method involves drilling, copper plating, hole blocking, etching, and hole plugging ink removal for hole plugging. Alternatively, the masking hole process can be used for precision hole plugging without ink cleaning.
The SMOBC process and plugging method are used for pattern electroplating and lead and tin stripping, with steps including copper clad board preparation, lead and tin removal, solder mask patterning, plating, and hole plugging. The plugging method involves drilling, copper plating, hole blocking, etching, and hole plugging ink removal for hole plugging. Alternatively, the masking hole process can be used for precision hole plugging without ink cleaning.
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