Introduction to the Demolding Process of Solder Paste Stencils in Surface Mount Technology Patch Processing
The quality of demolding directly affects the printing effect in SMT automatic solder paste printing machines, with Mark point recognition being a primary factor. Good solder paste performance is essential for smooth printing and reflow soldering, with specific requirements for storage life, moisture absorption, and wetting properties. Selecting solder pastes with suitable alloy particle sizes and viscosities is crucial for different product assembly densities and coating processes.