The rapid advancement of electronic technology has led to increasing challenges in PCB soldering, particularly false soldering, which can result in product defects that go undetected during testing, potentially damaging a brand’s reputation and causing financial losses.
False soldering and improper soldering in DIP plug-in and PCB assembly Read More »
With the increasing complexity of modern PCBA designs, optimizing PCB layout and solder mask design is crucial for improving manufacturability and ensuring reliable soldering, especially for devices with fine-pitch pins, where improper pad and solder mask alignment can lead to quality issues.
In SMT patch processing, optimal soldering requires proper iron tip positioning, avoiding excessive force, using the right tip size and temperature, and avoiding excess flux and unnecessary rework to prevent soldering issues and ensure joint reliability.
Analysis of Seven Common Issues in SMT Assembly Processes Read More »
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