SMT technology

What are the key considerations for PCB thermal design?

The thermal design of PCB layout involves careful component placement to manage heat dissipation, prevent overheating, and ensure reliability, with specific guidelines for component positioning, heat shielding, and optimizing airflow for effective cooling.

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Reinforcement for FPC component patch dispensing

Flexible circuit boards (FPCs), made from polyimide or polyester, are lightweight, bendable, and highly reliable, but require careful handling in manufacturing, such as the use of dispensers and epoxy resin adhesives, to ensure durability and overcome challenges like bubble formation during component reinforcement.

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THR (Through-Hole Reflow) Soldering Technology for PCB Components

The technical advantages and challenges of Surface-Mount Technology (SMT) and Through-Hole Technology (THT), discusses the integration of these technologies with the THR (Through-Hole Reflow) process to reduce production costs, and highlights design considerations for connectors suitable for THR assembly.

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Overview of the Three Primary Processes in SMT Placement

The SMT patch production process involves intricate steps such as printing, placement, and reflow soldering, with automation playing a crucial role, but understanding these processes can be challenging without firsthand factory experience.

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