solder

The influence of lead-free regulations on PCBs

The development of lead-free regulations has a significant impact on PCB board assembly, with increasing concern about lead pollution and a focus on compliance with strict regulatory requirements for hazardous substance prohibition in electronics manufacturing.

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Impact of SMT Chip Processing Technology Materials on Production Quality

Selecting appropriate process materials is essential for quality and efficiency in SMT patch processing, encompassing solder, flux, adhesive, and cleaning agents, which play critical roles in welding, bonding, and ensuring cleanliness post-soldering.

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SMT Assembly Process 2

The SMT assembly process is closely related to each process step before soldering, including capital investment, PCB design, component solderability, assembly operations, flux selection, temperature/time control, solder, and crystal structure, with the most commonly used solder for wave soldering being eutectic tin-lead alloy. Temperature control and solder purity are essential for ensuring quality solder joints.

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