Defects in soldering, such as bubbles, lack of solder, overheating, cold welding, copper foil lifting, pinhole formation, and rosin soldering, arise from various issues including thermal imbalance, insufficient solder, excessive heat, and improper techniques, each impacting joint strength and circuit reliability.
PCB soldering defects resulting from environmental factors. Read More »
Quality inspection of FR4 PCB includes X-ray testing for BGA solder joint defects, SAM scanning for hidden defects, side view inspection for solder joint conditions, screwdriver strength measurement, microsection analysis, and infiltration dyeing method. Causes of solder joint voids may include organic materials, solder, surface treatment, and large welding pads, with excessive voids affecting conductivity and heat transfer. BGA holes can be categorized into five types based on their location and source, and defects such as bridging, open circuits, and cold solder require careful examination.
Quality Inspection of FR4 PCBs and the Absence of Surface Mount Technology Read More »
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Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.
Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.
We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.