During BGA soldering, FR4 PCB manufacturers may experience issues such as voids, short circuits, and deformation due to temperature differences, which can be mitigated through proper heating slopes, preheating, and design improvements.
Causes of concurrent solder voiding and short circuiting in FR4 PCBs with BGAs Read More »
PCB boards are mainly made of a non-conductive substrate material with copper circuit layers, electronic components, printed symbols and text, as well as solder joints, working together to form the overall structure and functionality of the circuit board.
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