The third operation procedure of solder mask process in PCB board production involves repairing defects in the image and removing unrelated defects, while wearing gauze gloves to prevent contamination. Various common board defects can be solved by controlling electroplating current and checking for gaps in the squeegee blade, ensuring cleanliness during exposure, and using high viscosity printing material to prevent issues.

The third operation procedure of solder mask process in PCB board production involves repairing defects in the image and removing unrelated defects, while wearing gauze gloves to prevent contamination. Various common board defects can be solved by controlling electroplating current and checking for gaps in the squeegee blade, ensuring cleanliness during exposure, and using high viscosity printing material to prevent issues.