solder mask

PCB circuit board color and photoresist application.

The article explains why PCB circuit boards are green, noting that the green color comes from the solder mask used for protection, and it briefly describes different types of circuit boards, including flexible, rigid-flex, and traditional PCBs.

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Knowledge of PCB (Printed Circuit Board) design and technology.

A PCB (Printed Circuit Board) is a crucial component in electronics, providing electrical connections and mechanical support for various devices, and is manufactured through complex processes involving different types of laminates and layers.

Knowledge of PCB (Printed Circuit Board) design and technology. Read More »

Detailed Analysis of PCB Circuit Board Conductive Hole Plugging Process and Reasons

The evolution of electronic products toward smaller, denser designs has driven the demand for advanced PCBs, especially those using SMT and BGA technologies. As a result, hole plugging is crucial during component mounting to prevent solder from causing short circuits during PCB wave soldering. This process also prevents flux residue buildup, ensures vacuum sealing after component assembly, and maintains solder integrity on the board surface, crucial for reliable electronic performance. Achieving these goals involves intricate processes, such as hot air leveling and various hole-plugging techniques, tailored to meet stringent customer specifications and ensure high-quality PCB production.

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Factors Impacting Bare PCB Prices

Simplify your PCB journey with WellCircuits Limited. We offer quick-turnaround prototyping and turnkey PCBA services, ensuring smooth project progress with a focus on quality and efficiency. Trust us to bring your designs to life effortlessly. Choose WellCircuits Limited for a hassle-free PCB experience.

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Common Flexible PCB Issues & Solutions

1. Bubbles in screen printing are caused by poor adhesion between solder mask and substrate due to narrow spacing, leading to gas entrapment and elevation of lines; solution involves visual inspection and current control. 2. FPC board issues stem from delayed paper printing, causing ink buildup in holes and insufficient exposure, leading to irregularities; solutions include timely printing and high-mesh screens. 3. FPC surface contamination results from inadequate drying and liquid splashing before solder mask printing; solution involves visual inspection for oxidation during screen printing. 4. Uneven surfaces arise from contamination and ink accumulation due to neglecting cleanliness and timely paper printing; solutions include cleanroom maintenance and ink removal during printing. 5. Ghosting is caused by improper FPC positioning and ink removal, leading to ink accumulation and surface cracks; solutions involve firm paper fixation, timely ink removal, and precise exposure measurements.

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Creating 8-layer PCBs: Expert tips and techniques

The high-precision eight-layer printed circuit board goes through a complex production process, including drilling, plating, etching, and layer routing, to create via holes, blind holes, and buried vias for increased wiring space and optimal signal routing.

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Solutions for Flex PCB Quality Issues – Part 1

1. Small air bubbles in FPC circuit boards result from narrow wire frame spacing and excessive height, causing solder mask material to trap gas during printing. Solution: Ensure complete material coverage during screen printing and control electroplating current. 2. Solder mask hole issues stem from delayed paper printing, leading to ink residue accumulation and low mesh screens. Solution: Print paper promptly, use high mesh screens, and adjust printing material viscosity and angle. 3. Skipped printing occurs due to excessive electroplating current and gaps in the squeegee. Solution: Control electroplating current and ensure gap-free squeegees, inspecting for copper foil oxidation during screen printing. 4. Pinholes in patterns arise from debris on the photographing base plate obstructing exposure. Solution: Maintain base plate cleanliness throughout the exposure process.

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Factors Influencing the Quality of BGA Soldering Assembly

BGA pads’ type and solder mask position impact soldering; SMD offers larger bonding area but prone to cracking, while NSMD aids tracking but weakens bonding strength; selection depends on technical considerations; solder paste printing precision crucial for quality soldering.

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