solder paste

Title: Preventing Components from Dislodging During Secondary Reflow Soldering of SMT Assemblies: Part 4 Text: In our previous discussions, we delved into strategies for mitigating the risk of components dislodging during secondary reflow soldering processes. In this installment, we continue our exploration by examining additional techniques to uphold assembly integrity.

Leave a Comment / Uncategorized / By / / , , , ,

WellCircuits Limited advises against mixing high and low solder paste due to potential solder strength issues. Thorough reliability evaluations are necessary. For safer reflow, apply high-temperature paste on the first side and low-temperature paste on the second. Evaluate cost implications before re-welding, considering both post-re-welding and parts falling, and explore options like robot welding for consistency and quality.

Title: Preventing Components from Dislodging During Secondary Reflow Soldering of SMT Assemblies: Part 4 Text: In our previous discussions, we delved into strategies for mitigating the risk of components dislodging during secondary reflow soldering processes. In this installment, we continue our exploration by examining additional techniques to uphold assembly integrity. Read More »

Impact of SMT Chip Processing Technology Materials on Production Quality

Leave a Comment / Uncategorized / By / / , , , , ,

Selecting appropriate process materials is essential for quality and efficiency in SMT patch processing, encompassing solder, flux, adhesive, and cleaning agents, which play critical roles in welding, bonding, and ensuring cleanliness post-soldering.

Impact of SMT Chip Processing Technology Materials on Production Quality Read More »

Introduction to the Demolding Process of Solder Paste Stencils in Surface Mount Technology Patch Processing

Leave a Comment / Uncategorized / By / / , , , ,

The quality of demolding directly affects the printing effect in SMT automatic solder paste printing machines, with Mark point recognition being a primary factor. Good solder paste performance is essential for smooth printing and reflow soldering, with specific requirements for storage life, moisture absorption, and wetting properties. Selecting solder pastes with suitable alloy particle sizes and viscosities is crucial for different product assembly densities and coating processes.

Introduction to the Demolding Process of Solder Paste Stencils in Surface Mount Technology Patch Processing Read More »

Short Circuit Phenomenon in Surface Mount Technology (SMT) Assembly and Solutions – Part 1

Leave a Comment / Uncategorized / By / / , ,

Short-circuit defects in SMT chip processing, often called “bridging”, typically occur between fine-pitch IC pins, with solutions involving proper template design and solder paste selection tailored to the small pitch of the ICs.

Short Circuit Phenomenon in Surface Mount Technology (SMT) Assembly and Solutions – Part 1 Read More »

The issue of open welding in FR4 PCB BGA soldering and its solution

Leave a Comment / Uncategorized / By / / , , , , ,

The opening of FR4 PCB BGA welding can be caused by factors such as insufficient solder paste, poor solderability, poor coplanarity, mounting misalignment, thermal mismatch, and exhaust through the solder mask, with various effects described. Measures to address BGA weld opening include ensuring sufficient solder paste, improving the weldability of fr4 pcb pads, maintaining coplanarity of the fr4 pcb substrate, precisely mounting elements, avoiding excessive temperature gradients, covering through holes before wave soldering, and pre-drying elements.

The issue of open welding in FR4 PCB BGA soldering and its solution Read More »

Testing lead-free reflow soldering on FR4 PCB

Leave a Comment / Uncategorized / By / / , , , ,

The analysis and testing of soldering, welding, and hardening processes were conducted to ensure the FR-4 PCB structure meets industry standards for performance and durability, with a focus on identifying and addressing issues to improve overall quality and reliability.

Testing lead-free reflow soldering on FR4 PCB Read More »

Quality Issues with Lead-Free Soldering in FR4 PCBs

Leave a Comment / Uncategorized / By / / , , , , , ,

The causes of voids in solder joints on FR4 PCBs include unequal volume ratios of solder alloy and organic materials, formation of voids in BGA pad solder joints, surface treatment films, oxidation of tin powder and flux, solder pad rejection, and absorption of water by the solder paste.

Quality Issues with Lead-Free Soldering in FR4 PCBs Read More »

Refining the Through-Hole Assembly Process for Fr4 PCBs with Reflow Furnace Technology

Leave a Comment / Uncategorized / By / / , , , ,

The pin-in-paste method allows for direct insertion of plug-in parts into soldered through-holes on an FR4 PCB, eliminating the need for hand or wave soldering, but also has inherent limitations related to temperature resistance, solder pad design, solder amount, and testing of the circuit boards.

Refining the Through-Hole Assembly Process for Fr4 PCBs with Reflow Furnace Technology Read More »

China First 7-Day Delivery PCB Factory​, Free Samples Available.

info@wellcircuits.com

+86-19147709860

Quick Links

Company Info

Operating from China, WellCircuits stands as a top-tier manufacturer of premium PCBs & PCBAs.

Our expertise lies in crafting multilayer flexible circuits, rigid-flex PCBs, HDI PCBs, and Rogers PCBs.

We excel in rapid-turnaround PCB prototyping and thrive on handling challenging projects as our forte.

Connect

Facebook-f Youtube Linkedin Twitter

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)