The FPC imposition design process requires careful consideration of size limitations based on component complexity and SMT stability, optimizing production efficiency and ensuring precise alignment for solder paste printing and component placement.
DFM requirements for mounting SMD/SMC components on FPC Read More »
OSP, or Organic Solderability Preservatives, is a PCB surface treatment that prevents oxidation of copper pads during soldering, ensuring good solderability. It offers advantages like flatness, reliability, and cost-effectiveness, but can face issues such as film thickness control, storage conditions, and SMT technique errors affecting soldering quality, necessitating proper management for optimal performance.
Regarding Control of OSP Film Thickness and PCB Storage Read More »
The increasing environmental concerns and technological advancements in PCB surface treatment processes reflect a pivotal shift towards lead-free and halogen-free materials, promising significant transformations in future PCB board development.
Features and Applications of PCB Surface Treatment Technologies Read More »
The evolution of PCB surface treatment technology, influenced by environmental concerns and evolving industry standards, emphasizes lead-free and halogen-free processes like organic coating and electroless nickel plating/immersion gold, while also considering factors like component type and assembly requirements, leading to a dynamic landscape of options with a focus on meeting customer needs and environmental standards.
Numerous factors contribute to rosin joints in PCB processing, including process issues, poor solderability, via holes, component pin distortion, and oxidation.
What are the factors leading to rosin joint formation during PCB processing? Read More »
Production Board is a PCB board that meets design drawings, specifications, and procurement requirements in one batch. As Received products undergo mechanical testing without conditioning. Test Board determines batch quality, Test Pattern is used for testing, and Quality Conformance Test Circuit assesses printed board quality. Visual examination of appearance and size includes detecting issues like Blister, Bulge, or Cracking. Electrical and non-electrical properties, such as Contact Resistance or Bond Strength, are also assessed. Prepreg materials and adhesive films are evaluated for parameters like Resin Flow or Tack Time.
Terms for PCB board appearance and functional testing Read More »
Copper is commonly used on printed circuit boards for interconnecting components, but requires protection from oxidation and corrosion through technologies like organic paint, oxide film, and electroplating, with gold being a common plating material for high wear resistance and low contact resistance.
The Significance of Electroplating in PCB Manufacturing Read More »
The key factors causing circuit board soldering defects are poor solderability, warpage during welding, and inadequate board design.
Examination of the Three Primary Factors Contributing to Circuit Board Soldering Defects Read More »
Copper is commonly used on printed circuit boards for interconnecting components, but requires protection from oxidation and corrosion through technologies like organic paint, oxide film, and electroplating, with gold being a common plating material for high wear resistance and low contact resistance.
The Significance of Electroplating in PCB Manufacturing Read More »
The key factors causing circuit board soldering defects are poor solderability, warpage during welding, and inadequate board design.
Examination of the Three Primary Factors Contributing to Circuit Board Soldering Defects Read More »
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