Poor soldering in PCB design and production can lead to various defects, often caused by issues like insufficient tinning, contamination, inadequate flux, or improper soldering temperature, and requires proper prevention strategies such as chemical analysis, pre-plating treatment, and temperature control.
Limited understanding of tin usage in PCB circuit boards. Read More »
The article discusses various inspection methods for ensuring the quality and reliability of assembled PCB multilayer circuit boards, including the use of Automatic Optical Inspection (AOI), X-ray, ultrasound, laser, and infrared detection systems, as well as manual visual inspections, with a focus on key stages in the SMT process such as solder paste printing, component placement, and soldering.
Methods for Detection of Multilayer PCB Assemblies and SMT Processes Read More »
Dead copper in PCB design should generally be avoided due to its potential to cause EMI issues, but if retained, it should be properly grounded, as it can also enhance mechanical strength and provide shielding; meanwhile, common pad designs that share pads between components can lead to soldering defects, component displacement, and reliability issues.
PCB design for eliminating dead copper and ensuring optimal welding quality Read More »
PCBA processing requires strict adherence to operational guidelines to ensure quality and minimize defects, with key considerations including cleanliness, proper handling, careful design to prevent distortion, and effective management of ESD-sensitive components.
Overview of PCBA Processing and Factors Contributing to Distortion Read More »
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Analyze the PCB wave soldering process and its associated defects. Read More »
To minimize false soldering and soldering defects in PCBA processing, focus on moisture-proof component storage, use high-quality solder paste, adjust printing parameters and reflow soldering temperatures, minimize manual soldering, and maintain proper soldering iron temperatures.
How to prevent false soldering during PCBA manufacturing and assembly? Read More »
Defects in soldering, such as bubbles, lack of solder, overheating, cold welding, copper foil lifting, pinhole formation, and rosin soldering, arise from various issues including thermal imbalance, insufficient solder, excessive heat, and improper techniques, each impacting joint strength and circuit reliability.
PCB soldering defects resulting from environmental factors. Read More »
What are the key practices to prevent IC damage during PCBA processing?
PCBA processing protects ICs from damage caused by excessive voltage. Read More »
Factors influencing SMT soldering reliability, including misalignment of solder resist and cover film, surface contamination of pads, deformation of reinforcement plates, and varied processing technologies, underscore the critical need for meticulous SMD/SMC pad design and rigorous FPCB manufacturing processes to achieve flawless SMT assembly.
PCB design errors can lead to issues such as poor soldering quality and process inefficiencies, which are addressed through strict quality acceptance standards that include testing electrical performance, manufacturability, and adherence to design specifications.
PCB design errors and standards for PCB quality acceptance Read More »
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