stress relief

Lead Forming Process for PCBA Integrated Circuits

The main purpose of lead forming in integrated circuits is to facilitate soldering to PCB pads and mitigate environmental stresses like vibration and temperature variations, crucial for ensuring product reliability and solder joint integrity during operational testing.

Lead Forming Process for PCBA Integrated Circuits Read More »

Preventing Warping in Thick Copper PCBs: Effective Methods (Part 2)

Prepreg must be carefully oriented during lamination to prevent post-lamination warping, stress relief and straightening processes are crucial for PCB thick copper plates, and warped boards require baking and pressing for salvage, highlighting essential anti-warping measures in PCB manufacturing.

Preventing Warping in Thick Copper PCBs: Effective Methods (Part 2) Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)