surface treatment

Factors Leading to Defective PCB Surfaces and Recommended Repair Procedures

Insufficient bonding forces between PCB coatings can lead to separation and quality issues during production, influenced by factors such as substrate processing, surface treatment, micro-etching control, and contamination.

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How familiar are you with the PCB surface treatment process?

Although seemingly minor, current changes in PCB surface treatment processes are pivotal as environmental demands rise, driving future substantial evolution in ensuring excellent solderability and electrical properties.

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“Surface Treatment Processes in FPC Production Process 1”

The rapid development of China’s flexible printed circuit board industry is driven by the demand for light, thin, and high-performance electronic products, necessitating specialized surface treatment methods like chemical cleaning and non-woven brush rollers to ensure dimensional stability and surface quality.

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The Determinants of PCB Pricing

The price diversity of PCBs stems from factors like materials, surface treatments, design complexity, copper foil thickness, quality standards, fees, payment methods, order quantity, and delivery time, all of which contribute to the overall cost of production and should be considered when estimating prices.

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Immersion Gold (ENIG) and Gold Fingers

Immersion Gold (ENIG) is a surface treatment process that involves plating gold onto copper to prevent oxidation and improve conductivity, while Gold Finger refers to a row of equidistant square pads on a PCB circuit board used for electrical connections. The categories of PCB gold fingers include ordinary gold fingers, segmented gold fingers, and long and short gold fingers.

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Characteristics and Development Trends of PCB Surface Treatment Processes

The surface treatment of PCB plays a crucial role in ensuring good solderability and electrical properties, and as environmental concerns increase, the industry is moving towards lead-free and halogen-free processes. Hot air leveling and organic coating are two common surface treatment processes, each with its unique characteristics and benefits in protecting the copper surface.

Characteristics and Development Trends of PCB Surface Treatment Processes Read More »

Characteristics and Development Trends of PCB Surface Treatment Processes

The surface treatment of PCB plays a crucial role in ensuring good solderability and electrical properties, and as environmental concerns increase, the industry is moving towards lead-free and halogen-free processes. Hot air leveling and organic coating are two common surface treatment processes, each with its unique characteristics and benefits in protecting the copper surface.

Characteristics and Development Trends of PCB Surface Treatment Processes Read More »

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