SMT technology increases electronic equipment installation density, reducing effective heat dissipation area and affecting equipment temperature rise reliability. Thermal design research is important in PCB temperature rise analysis, considering power consumption, board structure, installation method, radiation, conduction, and convection. Thermal clad PCB principles include material selection, heat dissipation through-holes, use of conductive materials, and process methods to address various heat issues. Thermal simulation tools are used to accelerate thermal design based on proven experience and improve system electrical performance indicators.