thermal expansion

What is the Heat Dissipation System in a PCB Board?

In PCB board design, heat dissipation is crucial and can be achieved through various cooling methods, selection of components, and consideration of the coefficient of thermal expansion. WellCircuits Limited specializes in producing high-precision circuit boards to meet the diverse needs of customers in different industries, offering solutions such as blind buried vias, thick copper boards, and various types of circuit boards including HDI and rigid-flex combinations.

What is the Heat Dissipation System in a PCB Board? Read More »

Production of FR4 PCBs faces significant challenges due to extreme heat conditions

The potential bursting of FR4 PCBs during back welding is a result of the high heat stress and thermal expansion differences, especially in areas with dense through-holes and large surface copper areas, making it important to carefully manage the reflow process and consider alternatives to reduce the risk.

Production of FR4 PCBs faces significant challenges due to extreme heat conditions Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)