thermal stress

The damage caused by PCB board deformation

PCB deformation can result from complex thermal and mechanical stresses during manufacturing, causing issues like inaccurate component placement, difficulty in lead trimming, and improper fit in enclosures, which is exacerbated by uneven material properties, manufacturing processes, and storage conditions.

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Analysis and Optimization of Burst Plates in PCB Reflow Soldering

This document analyzes PCB board burst phenomena during reflow soldering, detailing the impact of moisture absorption, poor adhesion, inappropriate reflow temperatures, and design flaws, while suggesting improvements for enhanced soldering reliability.

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