Effective heat dissipation treatments on PCBs, such as incorporating heat-dissipating copper foil, utilizing thermal vias, exposing copper on the back of IC, and careful PCB layout considerations, are crucial for preventing overheating and ensuring optimal performance of electronic equipment.
Enhancing PCB Heat Dissipation: A Professional Approach Read More »
The thread discusses the use of 0.3mm thermal vias in DPAK power FETs pads and potential issues with solder protruding from the vias during PCB assembly. Possible solutions include using solder resist, leaded solder, and adjusting the reflow oven temperature.
The 03mm thermal vias in DPAK pads are experiencing severe failure. Read More »
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