Blind and Buried Via PCB fabrication services within a High Density Interconnect (HDI) PCB processing environment.

Modern electronic devices require PCB factories to adopt multi-layer HDI PCB buried blind via processing solutions to accommodate the large number of components on the surface, necessitating fine conductor widths and narrower spacing between them. WellCircuits Limited specializes in producing high-precision double-sided, multi-layer, impedance-controlled, blind buried vias, and thick copper circuit boards to meet customer demands for various products.

Blind and Buried Via PCB fabrication services within a High Density Interconnect (HDI) PCB processing environment. Read More »