1. **Finger Row Electroplating:** Electroplating method for applying gold onto edge connectors or protruding contacts of circuit boards, involving steps like coating removal, abrasion, activation, nickel plating, gold treatment, and drying. 2. **Through-Hole Plating:** Process involving electroplating the entire wall of substrate drilled holes, addressing challenges like resin accumulation and poor adhesion, with potential solutions including chemical treatments or using low-viscosity ink for direct electroplating.