The pin-in-paste method allows for direct insertion of plug-in parts into soldered through-holes on an FR4 PCB, eliminating the need for hand or wave soldering, but also has inherent limitations related to temperature resistance, solder pad design, solder amount, and testing of the circuit boards.
Refining the Through-Hole Assembly Process for Fr4 PCBs with Reflow Furnace Technology Read More »
PCB drilling is a crucial process in PCB manufacturing, involving through hole, blind hole, and buried hole drilling, which are essential for connecting circuits in different layers of the board and ensuring the board’s usability and functionality.
Three commonly used types of PCB drilling techniques Read More »
With the rapid development of the electronic industry, PCBs are evolving towards high density and precision, with different types of drilling holes emerging to meet production needs, such as through holes, blind holes, and buried holes. In high-speed PCB design, efforts can be made to reduce the adverse effects of parasitic effects caused by vias, such as choosing reasonable via hole sizes, using thinner PCB boards, minimizing unnecessary vias, and optimizing the placement of power and ground vias.
The aim is to standardize libraries with rectangular or oval pads for through hole components, but there are concerns about sharp corners and acid traps in PCB etching.
Rectangular or oval pads for through-hole packages. Read More »
Introduction to surface mount PCB design, seeking understanding of component selection and package sizes. Specific question on choosing between 0603 and 1608 SMD components. Requesting information and appreciation for help.
Selecting Package Dimensions for Surface Mount Passive Components Read More »
Multilayer PCBs are designed with multiple conductive layers to achieve high-speed signal transmission and efficient processing, with factors affecting the number of layers including the purpose of the circuit board, signal type, through-hole selection, and signal layer and pin density. The main reasons for multilayer PCB design include improving signal integrity, space utilization, power layering, and thermal management, with advantages including reduced circuit impedance, improved energy transmission efficiency, and reduced equipment weight.
What is the maximum number of layers that a PCB can have? Read More »
Two-layer PCB with some through hole pads only on bottom layer, need for different pad design, question about normalcy and PCB manufacturer notification.
Double-layer PCB with copper on the bottom layer and through-hole components Read More »
Mounting PCB at 90 degrees using right angle header, concerns about hole proximity to edge. Size and distance specifications needed.
How close is too close for through-hole near the PCB edge? Read More »
Connecting traces on double sided board using through hole part lead; seeking alternative to vias.
Creating custom PCBs without through-hole plating using DIY methods Read More »
Creating a spinning circuit on a hard disk drive platter may reduce vibration, but has potential issues due to material conductivity and drilling challenges.
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