In PCB production, the shift from lead-based to lead-free soldering processes is driven by environmental regulations, performance differences, and cost considerations, with lead-free technology offering better solderability and aligning with global sustainability efforts despite higher costs.
What are the consequences of lead presence on a PCB circuit board? Read More »
Common PCB surface treatment processes include lead-free or leaded tin spraying, hot air leveling (HAL), organic coating (OSP), chemical gold plating (electroless nickel/immersion gold), electroplating nickel gold, immersion silver, immersion tin, and halogen-free gold finger. Environmental concerns are driving a shift away from leaded processes towards lead-free options like tin spraying to comply with ROHS standards, crucial for passing audits and securing long-term product development partnerships. These treatments alter PCB components’ properties to ensure solderability and prevent oxidation, crucial for reliable electrical connections.
The surface treatment processes for PCB boards include various methods such as tin spraying, lead-free tin spraying, enig, and hard gold plating, all of which aim to achieve low cost, good weldability, harsh storage conditions, short time, environmentally friendly process, good welding, and flatness. Gold finger plates require patterning gold or ENIG processes due to their antioxidation properties and high conductivity, with ENIG being the more popular choice due to its better weldability, control of stress, resistance to oxidation, and better flatness.
Distinguishing Between PCB Gold Plating and ENIG Processes Read More »
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