In Shenzhen’s PCB assembly industry, PCBA manufacturers often face the “tombstone phenomenon” where chip components lift during SMT due to issues like uneven solder melting, pad design, solder paste thickness, temperature settings, and component contamination. Solutions involve proper pad design and strict material control. WellCircuits Limited, with nearly 20 years of experience in PCBA processing, offers expertise in resolving such defects and looks forward to collaboration.