Fast PCB board manufacturers must carefully select appropriate components and consider various factors like routing, shielding, heat dissipation, and layout tidiness during component placement on the circuit board surface, while also leaving room for the installation of shielding and heat dissipation structures. Components that cannot be mounted on the board should be segregated according to the electrical schematic diagram. Different methods like cross-line connection, socket connection, and additional plug and socket connection should be used for connecting the printed circuit board with electrical components.