4-Layer Ultra-Thin 0.25mm High-Density HDI PCB
As the electronic products become thinner and smaller the thickness and volume of PCB installed in these devices are smaller which promotes the gradual maturity of HDI technology resulting in ultra
Ultra-thin PCB
The manufacturing process for ultra-thin PCBs.
The trend towards ultra thin PCBs with high-density interconnections and small apertures is driving the development of new equipment and processes to overcome prior art shortcomings and provide a manufacturing method for fabricating ultra thin PCBs.
Ultra-thin PCB made with FR-4 materials
There is no absolute standard for thin PCBs, but they are typically referred to as boards with a thickness of less than 0.6mm. As demand for thinner devices grows, there is a trend towards using ultra-thin PCBs, made from specialized materials and requiring specialized equipment for production, to reduce processing and production costs.